Device and method for attaching protective tape to semiconductor wafer

ABSTRACT

To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus (1) for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape conveyance mechanism (2) configured to convey the protective tape (PT) temporarily applied to a base material (BM) to a peeling position; a tape holding body (30) capable of holding the protective tape (PT); a holding-body moving mechanism (31) configured to move the tape holding body (30) to the peeling position; and a peeling mechanism (4) configured to peel the base material (BM) from the protective tape (PT) held by the tape holding body (30) at the peeling position.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a U.S. National Stage application ofPCT/JP2018/016543, filed 24 Apr. 2018, the entire disclosure of which isincorporated herein by reference.

TECHNICAL FIELD

The present invention relates to an application apparatus and anapplication method for applying a protective tape to a semiconductorwafer with low tension.

BACKGROUND ART

A process of manufacturing a semiconductor chip generally involvesforming a circuit having irregularities on a front surface of asemiconductor wafer (hereinafter simply referred to as “wafer”) andthen, in order to satisfy the recent demand for downsizing thesemiconductor chip, grinding a back surface on an opposite side of thefront surface having the circuit formed thereon, to thereby reduce thewafer in thickness. When the wafer is reduced in thickness, a circuitforming portion is protected by applying a protective tape to the frontsurface of the wafer.

As a method of applying the protective tape to the front surface of thewafer, there has been proposed a method involving temporarily applyingthe protective tape, which is cut in advance in conformity with theshape of the wafer, to a band-shaped base material, causing theprotective tape to adhere to a circumferential surface of an applicationroller while peeling the protective tape from the band-shaped basematerial with the application roller that rotates while pressing theprotective tape, and then pressing the protective tape against the frontsurface of the wafer with the application roller, to thereby apply theprotective tape to the front surface of the wafer (see, for example,Patent Literature 1).

CITATION LIST Patent Literature

[PTL 1] JP 5828532 B2

SUMMARY OF INVENTION Technical Problem

However, when the protective tape is caused to adhere to thecircumferential surface of the application roller by pressing theprotective tape with the rotating application roller as in PatentLiterature 1, excessive tension is applied to the protective tape, andhence residual stress is generated on the protective tape. When theresidual stress is generated on the protective tape, in the case wherethe wafer is reduced in thickness by grinding the back surface of thewafer having the protective tape applied thereto, there is a problem,for example, in that the wafer is warped or broken due to the residualstress on the protective tape.

The present invention has been made to solve the above-mentionedproblem, and provides an application apparatus and an application methodfor applying a protective tape to a semiconductor wafer, in whichresidual stress generated on the protective tape can be reduced at atime of application of the protective tape to the semiconductor wafer.

Solution to Problem

In order to solve the above-mentioned problem, according to oneembodiment of the present invention, there is provided an applicationapparatus for applying a protective tape to a semiconductor wafer,including: a tape conveyance mechanism configured to convey theprotective tape temporarily applied to a base material to a peelingposition; a tape holding body capable of holding the protective tape; aholding-body moving mechanism configured to move the tape holding bodyto the peeling position; and a peeling mechanism configured to peel thebase material from the protective tape held by the tape holding body atthe peeling position.

According to one preferred embodiment of the present invention, theapplication apparatus further includes a frame base configured tosupport a dicing frame on which the semiconductor wafer is mounted, inwhich the holding-body moving mechanism is configured to move the tapeholding body above the frame base, to thereby apply the protective tapeto the dicing frame.

According to one preferred embodiment of the present invention, theapplication apparatus further includes: an application table configuredto support the semiconductor wafer; and a raising and lowering mechanismconfigured to raise and lower the application table, in which the framebase is arranged in a periphery of and above the application table, andin which the raising and lowering mechanism is configured to raise theapplication table, to thereby apply the protective tape to thesemiconductor wafer.

Further, according to one preferred embodiment of the present invention,in the application apparatus, the base material has a band shape and hasa plurality of protective tapes arranged on the base material atintervals along a conveyance direction of the base material. The peelingmechanism includes a peeling plate and a peeling plate moving mechanismconfigured to cause the peeling plate to reciprocate in the conveyancedirection of the base material, the peeling mechanism being configuredto peel the base material from the protective tape by moving the peelingplate in a direction opposite to the conveyance direction of the basematerial while folding back the base material with a distal end of thepeeling plate.

Further, according to one preferred embodiment of the present invention,in the application apparatus, the tape holding body includes anadsorption member capable of adsorbing an entire surface of theprotective tape.

Further, according to one preferred embodiment of the present invention,in the application apparatus, the holding-body moving mechanism includesan up-and-down moving mechanism configured to move the tape holding bodyin an up-and-down direction and a reciprocation mechanism configured tocause the tape holding body to reciprocate in an X direction along ahorizontal surface and in a Y direction orthogonal to the X direction.

In order to solve the above-mentioned problem, according to oneembodiment of the present invention, there is provided an applicationmethod of applying a protective tape to a semiconductor wafer,including: a tape conveyance step of conveying the protective tapetemporarily applied to a base material to a peeling position; aholding-body moving step of moving a tape holding body capable ofholding the protective tape to the peeling position; and a peeling stepof peeling the base material from the protective tape held by the tapeholding body at the peeling position.

Further, according to one preferred embodiment of the present invention,the application method further includes a tape application step ofapplying the protective tape to a dicing frame by moving the tapeholding body above a frame base configured to support the dicing frameand of mounting the semiconductor wafer on the dicing frame throughintermediation of the protective tape.

Advantageous Effects of Invention

According to the present invention, the base material is peeled by thepeeling mechanism under a state in which the protective tape is held bythe tape holding body. With this, the protective tape can be held withlow tension so that residual stress does not remain. Further, even whenthe base material is peeled from the protective tape, a load applied tothe protective tape can be extremely approximated to zero. As a result,the protective tape can be applied to the wafer under a state in whichthe residual stress is reduced. Therefore, when the wafer is reduced inthickness by grinding a back surface thereof, the wafer can be preventedfrom being warped or broken due to the residual stress on the protectivetape.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view for illustrating a schematic configuration of anapplication apparatus.

FIG. 2 is a sectional view of a tape peeling section of FIG. 1 takenalong the line I-I.

FIG. 3 is a plan view of a base material having a protective tapetemporarily applied thereto.

FIG. 4 is a sectional view of FIG. 3 taken along the line II-II.

FIG. 5 is an explanatory view for illustrating a step of peeling theprotective tape from the base material.

FIG. 6 is an explanatory view for illustrating the step of peeling theprotective tape from the base material.

FIG. 7 is an explanatory view for illustrating the step of peeling theprotective tape from the base material.

FIG. 8 is a front view for illustrating a schematic configuration of afirst alignment device.

FIG. 9 is an explanatory view for illustrating an image pickup operationby image pickup means of the first alignment device.

FIG. 10 is a front view for illustrating a schematic configuration of asecond alignment device.

FIG. 11 is a side view for illustrating the schematic configuration ofthe second alignment device.

FIG. 12 is an explanatory view for illustrating a step of applying theprotective tape to a wafer.

FIG. 13 is an explanatory view for illustrating the step of applying theprotective tape to the wafer.

FIG. 14 is an explanatory view for illustrating the step of applying theprotective tape to the wafer.

FIG. 15 is an explanatory view for illustrating the step of applying theprotective tape to the wafer.

FIG. 16 is an explanatory view for illustrating the step of applying theprotective tape to the wafer.

FIG. 17 is an explanatory view for illustrating the step of applying theprotective tape to the wafer.

FIG. 18 is a bottom view of a pressing member.

FIG. 19 are each an explanatory view for illustrating a pressingposition by the pressing member when the protective tape is applied tothe wafer.

FIG. 20 is a front view for illustrating schematic configurations of aheating table and a conveyance table.

FIG. 21 are each a partially enlarged sectional view of a dicing framehaving the wafer mounted thereon placed on the heating table.

FIG. 22 is an explanatory view for illustrating a step of heating thedicing frame having the wafer mounted thereon.

FIG. 23 is an explanatory view for illustrating the step of heating thedicing frame having the wafer mounted thereon.

FIG. 24 is an explanatory view for illustrating a step of accommodatingthe heated dicing frame.

FIG. 25 is an explanatory view for illustrating the step ofaccommodating the heated dicing frame.

FIG. 26 is an explanatory view for illustrating the step ofaccommodating the heated dicing frame.

FIG. 27 is an explanatory view for illustrating the step ofaccommodating the heated dicing frame.

FIG. 28 is an explanatory view for illustrating the step ofaccommodating the heated dicing frame.

FIG. 29 is an explanatory view for illustrating a step of cutting thewafer from the heated dicing frame.

FIG. 30 is an explanatory view for illustrating the step of cutting thewafer from the heated dicing frame.

FIG. 31 is an explanatory view for illustrating the step of cutting thewafer from the heated dicing frame.

FIG. 32 is an explanatory view for illustrating a step of accommodatingthe wafer cut from the dicing frame.

FIG. 33 is an explanatory view for illustrating the step ofaccommodating the wafer cut from the dicing frame.

FIG. 34 is an explanatory view for illustrating a step of accommodatingthe dicing frame having the cut wafer.

FIG. 35 is an explanatory view for illustrating the step ofaccommodating the dicing frame having the cut wafer.

DESCRIPTION OF EMBODIMENTS

An object of the present invention is to, in an application apparatusand an application method for applying a protective tape to asemiconductor wafer (hereinafter simply referred to as “wafer”), reduceresidual stress generated on the protective tape at a time ofapplication of the protective tape to the wafer by peeling theprotective tape formed into a predetermined shape in advance andtemporarily applied to a base material from the base material underreduced tension, holding the peeled protective tape, and applying theprotective tape to the wafer.

In order to achieve the above-mentioned object, the applicationapparatus according to the present invention includes: a tape conveyancemechanism configured to convey the protective tape temporarily appliedto a base material to a peeling position; a tape holding body capable ofholding the protective tape; a holding-body moving mechanism configuredto move the tape holding body to the peeling position; and a peelingmechanism configured to peel the base material from the protective tapeheld by the tape holding body at the peeling position. The feature ofthe application apparatus according to the present invention isdescribed mainly in a tape peeling section A in the following embodimentof the present invention. In the following, the embodiment of thepresent invention is described with reference to the accompanyingdrawings, but the present invention is not limited to only theembodiment described with reference to the accompanying drawings. Notethat, in each figure, each thickness of a wafer W, a dicing frame DF, aprotective tape PT, a base material BM, a protective layer PL, and apressure-sensitive adhesive layer AL are drawn in an exaggerated mannerfor ease of understanding.

FIG. 1 is a plan view for schematically illustrating an entireconfiguration of an application apparatus 1 according to thisembodiment. The application apparatus 1 includes the tape peelingsection A configured to peel the protective tape PT temporarily appliedto the base material BM from the base material BM, a tape alignmentsection B configured to position the protective tape PT, a wafer supplysection C configured to accommodate a plurality of wafers W, a waferalignment section D configured to position the wafer W, a frame supplysection E configured to accommodate a plurality of dicing frames DF, atape application section F configured to apply the protective tape PT tothe wafer W and mount the wafer W on the dicing frame DF throughintermediation of the protective tape PT, a heating section G configuredto heat the wafer W mounted on the dicing frame DF, and a frameaccommodating section H configured to accommodate the dicing frame DFafter the wafer W is heated.

The application apparatus 1 further includes various devices configuredto perform various operations in each section and convey the protectivetape PT, the wafer W, the dicing frame DF, and the like between thesections, and a control device (not shown) configured to controloperations of the various devices and process signals and data receivedfrom the various devices. The various devices and the control device arearranged on a machine base 100. The control device can be formed of, forexample, a computer that includes a microcomputer, a memory, and an HDD,and has processing ability imparted by software.

First, as illustrated in FIG. 1 and FIG. 2, in order to peel theprotective tape PT temporarily applied to the base material BM from thebase material BM, the tape peeing section A includes a tape conveyancemechanism 2, a tape conveyance unit 3, and a peeling mechanism 4.

The tape conveyance mechanism 2 is configured to convey the protectivetape PT temporarily applied to the base material BM to a peelingposition. The tape conveyance mechanism 2 includes a supply roll 20 ofthe base material BM having the protective tape PT temporarily appliedthereto, a recovery roll 21 of the base material BM having theprotective tape PT peeled therefrom, and a plurality of guide rollers 22configured to guide the base material BM. The supply roll 20 isconfigured to support the base material BM wound into a roll shape. Therecovery roll 21 is configured to take up the base material BM. The basematerial BM is fed from the supply roll 20 to be conveyed throughrotation drive of the recovery roll 21.

The base material BM is, for example, a PET film or a cardboardsubjected to release treatment, and is fed from the supply roll 20 to beconveyed in a band shape. As illustrated in FIG. 1, FIG. 3, and FIG. 4,a plurality of protective tapes PT, each being cut into a circular shapein advance, are arranged on a front surface of the base material BM atpredetermined intervals along a conveyance direction. In thisembodiment, the protective tape PT has an outer diameter set to belarger than that of the wafer W. Further, the protective tape PT has acircular protective layer PL with an outer diameter smaller than that ofthe wafer W (for example, a diameter smaller by about 2 mm than that ofthe wafer W) formed on one surface and has a pressure-sensitive adhesivelayer AL formed on the periphery of the protective layer PL. Theprotective layer PL is softened by heating to follow irregularities ofthe wafer W, thereby being brought into close contact therewith. Thus,the wafer W is ground to be flat when a back surface of the wafer W isground in a subsequent step. Further, when the protective layer PL ispeeled from the wafer W that has undergone a processing step, forexample, back surface grinding, the protective layer PL can be peeledfrom the wafer W completely without any residual paste. Further, a partof the protective tape PT on an outer peripheral side is applied to anouter peripheral edge portion of the wafer W on an outer side from acircuit forming portion through intermediation of the pressure-sensitiveadhesive layer AL, and the wafer W is protected when the circuit formingportion is covered with the protective layer PL.

As illustrated in FIG. 1 and FIG. 2, the tape conveyance unit 3 includesa tape holding body 30 capable of holding the protective tape PT and aholding-body moving mechanism 31 configured to move the tape holdingbody 30 onto the protective tape PT conveyed to the peeling position.

The tape holding body 30 is configured to hold the protective tape PT,which is conveyed to the peeling position by the tape conveyancemechanism 2, from a front surface side. In this embodiment, the tapeholding body 30 holds the protective tape PT by adsorption and is formedof a fixing member 300 having a porous adsorption member 301 fixedthereto, for example, as illustrated in FIG. 7 and FIG. 8. Adecompression pump (not shown), for example, a vacuum pump is connectedto the adsorption member 301, and the adsorption member 301 can adsorband hold the protective tape PT on a front surface thereof. In thisembodiment, the adsorption member 301 has an outer diameter that issubstantially equal to (equal to or somewhat larger than) that of theprotective tape PT and holds an entire surface of the protective tape PTby adsorption.

As illustrated in FIG. 1 and FIG. 2, the holding-body moving mechanism31 includes a first up-and-down moving mechanism 310 configured to causethe tape holding body 30 to reciprocate in a Z direction (up-and-downdirection) along a vertical direction, a reciprocation mechanism(hereinafter referred to as “first reciprocation mechanism”) 320configured to cause the tape holding body 30 to reciprocate in an Xdirection (front-and-back direction) along a horizontal surface, and areciprocation mechanism (hereinafter referred to as “secondreciprocation mechanism”) 330 configured to cause the tape holding body30 to reciprocate in a Y direction (right-and-left direction) that isalong the horizontal surface and orthogonal to the X direction.

The first up-and-down moving mechanism 310 is configured to move thetape holding body 30 in the up-and-down direction between the peelingposition at which the tape holding body 30 holds the protective tape PT(see FIG. 6) and a separation position above the peeling position (seeFIG. 5). There is no particular limitation on the first up-and-downmoving mechanism 310 as long as the first up-and-down moving mechanism310 moves the tape holding body 30 in the up-and-down direction.

As illustrated in FIG. 1 and FIG. 2, the first up-and-down movingmechanism 310 of this embodiment includes a ball screw configured todrive the tape holding body 30 so as to reciprocate, and a guidemechanism configured to guide reciprocation of the tape holding body 30.The ball screw and the guide mechanism are arranged on a support frame317. The ball screw includes a screw shaft 311, a nut member 312, and aball (not shown), and the nut member 312 is connected to the tapeholding body 30 through intermediation of a connecting member 313. Theball screw uses a motor 314 as a drive source and converts forward andbackward rotation of the motor 314 into reciprocating linear motion in ascrew shaft direction to move the tape holding body 30 in theup-and-down direction. The guide mechanism includes a pair of right andleft guide rails 315 extending in the up-and-down direction and a pairof right and left sliders 316 slidably mounted on the correspondingguide rails 315. The pair of guide rails 315 and the pair of sliders 316are arranged so as to sandwich the ball screw therebetween. The pair ofsliders 316 are arranged in a perpendicular portion of the connectingmember 313, and the pair of guide rails 315 are arranged on the supportframe 317. In the guide mechanism, each of the sliders 316 slides on thecorresponding guide rail 315 to assist the tape holding body 30 to movestraight in the Z direction (up-and-down direction).

As illustrated in FIG. 1 and FIG. 2, the first reciprocation mechanism320 is configured to cause the tape holding body 30 to reciprocate inthe X direction. In the tape peeling section A, the conveyance directionof the base material BM is directed in the X direction, and the firstreciprocation mechanism 320 causes the tape holding body 30 toreciprocate in the conveyance direction of the base material BM to placethe tape holding body 30 at the peeing position. There is no particularlimitation on the first reciprocation mechanism 320 as long as the firstreciprocation mechanism 320 causes the tape holding body 30 toreciprocate in the X direction. The first reciprocation mechanism 320 ofthis embodiment includes a rail 321 that is formed in a horizontalportion of the connecting member 313 and extends in the X direction anda slider 322 that is connected to a support member 32 and slidablymounted on the rail 321. The tape holding body 30 can reciprocate in theX direction along the rail 321 through intermediation of the slider 322with a drive source (not shown).

As illustrated in FIG. 1 and FIG. 2, the second reciprocation mechanism330 causes the tape holding body 30 to reciprocate in the Y directionorthogonal to the X direction. In the tape peeling section A, the Ydirection crosses the conveyance direction of the base material BM, andthe second reciprocation mechanism 330 causes the tape holding body 30to reciprocate in the Y direction to place the tape holding body 30 atthe peeling position. Further, the second reciprocation mechanism 330causes the tape holding body 30 to reciprocate in the Y direction toconvey the tape holding body 30 from the tape peeling section A to thetape alignment section B and the tape application section F in thestated order. There is no particular limitation on the secondreciprocation mechanism 330 as long as the second reciprocationmechanism 330 causes the tape holding body 30 to reciprocate in the Ydirection. The second reciprocation mechanism 330 of this embodimentincludes a pair of upper and lower rails 331 extending in the Ydirection and a pair of upper and lower sliders 332 slidably mounted onthe corresponding rails 331. The pair of sliders 332 are arranged on asupport member 333 fixed to the support frame 317, and the pair of rails331 are arranged on a side plate 101 arranged upright on the machinebase 100. The tape holding body 30 can reciprocate in the Y directionalong the rails 331 through intermediation of the sliders 332 with adrive source (not shown).

As illustrated in FIG. 1 and FIG. 2, the peeling mechanism 4 isconfigured to peel the base material BM from the protective tape PT heldby the tape holding body 30 of the tape conveyance unit 3 and includes apeeling plate 40 and a peeling plate moving mechanism 41 configured tocause the peeling plate 40 to reciprocate in the conveyance direction ofthe base material BM. The peeling plate 40 has a pointed edge at adistal end, and the base material BM to which the protective tape PT istemporarily applied is rapidly folded by the edge at the distal end ofthe peeling plate 40 after passing through a region on the peeling plate40. The peeling plate 40 is supported on a pair of right and leftsupport plates 42. A pair of front and back guide rollers 43 arerotatably laid between the pair of support plates 42. The base materialBM that is folded by the edge at the distal end of the peeling plate 40is guided by the pair of guide rollers 43 and taken up by the recoveryroll 21 via the plurality of guide rollers 22.

As illustrated in FIG. 6 and FIG. 7, the peeling plate moving mechanism41 is configured to peel the base material BM from the protective tapePT held by the tape holding body 30 by moving the peeling plate 40 atthe peeling position in a direction opposite to the conveyance directionof the base material BM. There is no particular limitation on thepeeling plate moving mechanism 41 as long as the peeling plate movingmechanism 41 causes the peeling plate 40 to reciprocate in theconveyance direction of the base material BM.

As illustrated in FIG. 1 and FIG. 2, the peeling plate moving mechanism41 of this embodiment includes a ball screw configured to drive thepeeling plate 40 so as to reciprocate and a guide mechanism configuredto guide reciprocation of the peeling plate 40. The ball screw includesa screw shaft 410, a nut member 411, and a ball (not shown), and the nutmember 411 is connected to the support plate 42 configured to supportthe peeling plate 40 through intermediation of a connecting member 412.The ball screw uses a motor 413 as a drive source and converts forwardand backward rotation of the motor 413 into reciprocating linear motionin a screw shaft direction to cause the peeling plate 40 to reciprocatein the X direction. The guide mechanism includes a pair of right andleft guide rails 414 extending in the X direction and a pair of rightand left sliders 415 slidably mounted on the corresponding guide rails414. The pair of guide rails 414 and the pair of sliders 415 arearranged so as to sandwich the peeling plate 40 therebetween. The pairof sliders 415 are arranged on the corresponding support plates 42, andthe pair of guide rails 414 are arranged on a pair of side plates 102.The pair of side plates 102 are arranged upright on the machine base 100so as to be opposed to each other at an interval. In the guidemechanism, each of the sliders 415 slides on the corresponding guiderail 414 to assist the peeling plate 40 to reciprocate straight in the Xdirection.

In the tape peeling section A, the entire surface of the protective tapePT conveyed to the peeling position by the tape conveyance mechanism 2is held by the tape holding body 30, and the base material BM is peeledby the peeling mechanism 4 under a state in which the entire surface ofthe protective tape PT is held by the tape holding body 30. Then, thetape holding body 30 holding the protective tape PT is conveyed to thetape alignment section B and the tape application section F in thestated order by the holding-body moving mechanism 31.

Next, as illustrated in FIG. 1, the tape alignment section B includes afirst alignment device 5 in order to position the protective tape PTconveyed from the tape peeling section A while being held by the tapeholding body 30. The first alignment device 5 is configured to positionthe protective tape PT by detecting an outer peripheral edge portion ofthe protective layer PL of the protective tape PT.

As illustrated in FIG. 8, the first alignment device 5 includes imagepickup means 50 for imaging the outer peripheral edge portion of theprotective layer PL, illumination means 51 for illuminating a part ofthe outer peripheral edge portion of the protective layer PL to beimaged by the image pickup means 50, and an image pickup means movingmechanism 52 configured to cause the image pickup means 50 toreciprocate in the X direction along the horizontal surface and the Ydirection orthogonal to the X direction.

As the image pickup means 50, for example, a CCD camera or a C-MOScamera is used. In order to image a plurality of parts (preferably fourparts) of the outer peripheral edge portion of the protective layer PL,a plurality of image pickup means 50 may be respectively arranged at aplurality of parts in a concentric shape corresponding to the outerperipheral edge portion of the protective layer PL. However, in thisembodiment, as illustrated in FIG. 9, a plurality of parts (four partsin FIG. 9) of the outer peripheral edge portion of the protective layerPL are imaged with one image pickup means 50 by moving the one imagepickup means 50 with the image pickup means moving mechanism 52. Whenthe image pickup means 50 images the plurality of parts of the outerperipheral edge portion of the protective layer PL, the image pickupmeans 50 outputs the image data thereof to a control device (not shown).

Further, as illustrated in FIG. 8, the image pickup means 50 issupported by a perpendicular rail 54 arranged upright on a support base53 through intermediation of a raising and lowering member 55. The imagepickup means 50 can be raised and lowered by moving the raising andlowering member 55 in the up-and-down direction (Z direction) throughuse of a cylinder or the like.

As illustrated in FIG. 8, the illumination means 51 is supported by aguide 56 arranged upright on the support base 53 so as to move upwardand downward through use of appropriate drive means (not shown). Theillumination means 51 includes a light-emitting portion 510, forexample, a light-emitting diode as a light source and has thelight-emitting portion 510 fixed in a light-guiding member 511. Theillumination means 51 performs ring illumination for emitting light in aring shape and has, for example, a plurality of light-emitting portions510 arranged in a circumferential shape.

As illustrated in FIG. 8, the image pickup means moving mechanism 52includes a reciprocation mechanism (hereinafter referred to as “thirdreciprocation mechanism”) 520 configured to cause the image pickup means50 to reciprocate in the X direction along the horizontal surface and areciprocation mechanism (hereinafter referred to as “fourthreciprocation mechanism”) 530 configured to cause the image pickup means50 to reciprocate in the Y direction that is along the horizontalsurface and orthogonal to the X direction.

There is no particular limitation on the third reciprocation mechanism520 as long as the third reciprocation mechanism 520 causes the imagepickup means 50 to reciprocate in the X direction. The thirdreciprocation mechanism 520 of this embodiment includes a ball screwconfigured to drive the image pickup means 50 so as to reciprocate inthe X direction and a guide mechanism configured to guide reciprocationof the image pickup means 50 in the X direction. The ball screw includesa screw shaft 521, a nut member 522, and a ball (not shown), and the nutmember 522 is connected to the support plate 53 configured to supportthe image pickup means 50 through intermediation of a connecting member523. The ball screw uses a motor (not shown) as a drive source andconverts forward and backward rotation of the motor into reciprocatinglinear motion in a screw shaft direction to cause the image pickup means50 to reciprocate in the X direction. The guide mechanism includes apair of right and left guide rails 524 extending in the X direction anda pair of right and left sliders 525 slidably mounted on thecorresponding guide rails 524. The pair of guide rails 524 and the pairof sliders 525 are arranged so as to sandwich the ball screwtherebetween. Each of the sliders 525 is arranged on the connectingmember 523, and each of the guide rails 524 is arranged on a supportplate 526 extending in the Y direction. In the guide mechanism, each ofthe sliders 525 slides on the corresponding guide rail 524 to assist theimage pickup means 50 to reciprocate straight in the X direction.

There is no particular limitation on the fourth reciprocation mechanism530 as long as the fourth reciprocation mechanism 530 causes the imagepickup means 50 to reciprocate in the Y direction. The fourthreciprocation mechanism 530 of this embodiment includes a ball screwconfigured to drive the image pickup means 50 so as to reciprocate inthe Y direction and a guide mechanism configured to guide reciprocationof the image pickup means 50 in the Y direction. The ball screw includesa screw shaft 531, a nut member 532, and a ball (not shown), and the nutmember 532 is connected to the support plate 53 configured to supportthe image pickup means 50 through intermediation of the support plate526 and the connecting member 523. The ball screw uses a motor 533 as adrive source and converts forward and backward rotation of the motor 533into reciprocating linear motion in a screw shaft direction to cause theimage pickup means 50 to reciprocate in the Y direction. The guidemechanism includes a pair of right and left guide rails 534 extending inthe Y direction and a plurality of pairs of right and left sliders 535slidably mounted on the corresponding guide rails 534. The pair of guiderails 534 and the pair of sliders 535 are arranged so as to sandwich theball screw therebetween. Each of the sliders 535 is arranged on thesupport plate 526, and each of the guide rails 534 is arranged on asupport frame 536 extending in the Y direction. In the guide mechanism,each of the sliders 535 slides on the corresponding guide rail 534 toassist the image pickup means 50 to reciprocate straight in the Ydirection.

In the tape alignment section B, the image pickup means 50 images aplurality of parts of the outer peripheral edge portion of theprotective layer PL. A control device (not shown) processes image dataacquired from the image pickup means 50 to obtain positional informationon the plurality of parts of the outer peripheral edge portion of theprotective layer PL, to thereby calculate a center position of theprotective layer PL. Then, the control device (not shown) compares thecenter position of the protective layer PL to a predefined referenceposition of a center of the protective layer PL and controls theholding-body moving mechanism 31 based on a positional displacementamount between the center position and the reference position, tothereby correct the position of the tape holding body 30 in the Xdirection and the Y direction and align the center of the protectivelayer PL with the reference position. The protective tape PT subjectedto positioning is conveyed to the tape application section F by theholding-body moving mechanism 31 under a state of being held by the tapeholding body 30.

Next, as illustrated in FIG. 1, the wafer supply section C includes anaccommodating cassette 10 capable of accommodating a plurality of wafersW in a stacked state. The accommodating cassette 10 can be raised andlowered through use of a raising and lowering mechanism (not shown), forexample, an elevator mechanism. In the wafer supply section C, theaccommodating cassette 10 is raised and lowered every time the wafer Wis taken out by a first wafer conveyance mechanism 7, and the pluralityof wafers W are successively supplied to the first wafer conveyancemechanism 7.

As illustrated in FIG. 1, in this embodiment, the first wafer conveyancemechanism 7 is a robot arm and includes an articulated arm 70 and a hand71 formed at a distal end of the arm 70. The arm 70 includes a pluralityof links 72 pivotably coupled to each other, and the link 72 at aproximal end is pivotably coupled to a shaft 73. In this embodiment, thehand 71 is an adsorption-type hand capable of holding the wafer W byadsorption. The hand 71 holds the wafer W by adsorbing a front surfaceof the wafer W and is configured to adsorb an outer peripheral portionof the front surface of the wafer W in which a pattern is not formed. Inthe first wafer conveyance mechanism 7, the wafers W are successivelytaken out one by one from the wafer supply section C by the hand 71, andthen the wafer W held by the hand 71 is conveyed and supplied to thewafer alignment section D and the tape application section F in thestated order by expansion and contraction, and pivoting of the arm 70.As the hand 71, a non-contact hand capable of holding the wafer W in anon-contact manner may be used.

Next, as illustrated in FIG. 1, the wafer alignment section D includes asecond alignment device 8 in order to position the wafer W conveyed bythe first wafer conveyance mechanism 7. The second alignment device 8 isconfigured to position the wafer W by detecting the outer peripheraledge portion of the wafer W.

As illustrated in FIG. 10 and FIG. 11, the second alignment device 8includes a rotary table 80 having a diameter smaller than that of thewafer W, a rotation drive mechanism 81 configured to rotate the rotarytable 80, a table moving mechanism 82 configured to cause the rotarytable 80 to reciprocate in the X direction along the horizontal surfaceand the Y direction orthogonal to the X direction, illumination means 83for illuminating the wafer W with red light from one surface side (lowerside in the illustrated example) of the wafer W, and image pickup means84 for imaging the wafer W on the other surface side (upper side in theillustrated example) of the wafer W.

The rotary table 80 is configured to place and hold the wafer W on anupper surface thereof. In this embodiment, the rotary table 80 isconfigured to hold the wafer W by adsorption. The rotary table 80 isrotatably supported by a support frame 801 through intermediation of arotary shaft 800.

There is no particular limitation on the rotation drive mechanism 81 aslong as the rotation drive mechanism 81 rotates the rotary table 80. Therotation drive mechanism 81 of this embodiment includes a motor 810serving as a drive source, a drive pulley 811 connected to the motor810, a driven pulley 812 mounted on the rotary shaft 800, and a belt 813stretched between the drive pulley 811 and the driven pulley 812. Thosecomponents are arranged on the support frame 801.

The table moving mechanism 82 includes a reciprocation mechanism(hereinafter referred to as “fifth reciprocation mechanism”) 820configured to cause the rotary table 80 to reciprocate in the Xdirection along the horizontal surface and a reciprocation mechanism(hereinafter referred to as “sixth reciprocation mechanism”) 830configured to cause the rotary table 80 to reciprocate in the Ydirection that is along the horizontal surface and orthogonal to the Xdirection.

There is no particular limitation on the fifth reciprocation mechanism820 as long as the fifth reciprocation mechanism 820 causes the rotarytable 80 to reciprocate in the X direction. The fifth reciprocationmechanism 820 of this embodiment includes a ball screw configured todrive the rotary table 80 so as to reciprocate in the X direction and aguide mechanism configured to guide reciprocation of the rotary table 80in the X direction. The ball screw includes a screw shaft 821, a nutmember 822, and a ball (not shown), and the nut member 822 is connectedto the support frame 801 configured to support the rotary table 80. Theball screw uses a motor 823 as a drive source and converts forward andbackward rotation of the motor 823 into reciprocating linear motion in ascrew shaft direction to cause the rotary table 80 to reciprocate in theX direction. The guide mechanism includes a guide rail 824 extending inthe X direction and a pair of sliders 825 slidably mounted on the guiderail 824. Each of the sliders 825 is arranged on the support frame 801,and the guide rail 824 is arranged on a support base 802. In the guidemechanism, each of the sliders 825 slides on the corresponding guiderail 824 to assist the rotary table 80 to reciprocate straight in the Xdirection.

There is no particular limitation on the sixth reciprocation mechanism830 as long as the sixth reciprocation mechanism 830 causes the rotarytable 80 to reciprocate in the Y direction. The sixth reciprocationmechanism 830 of this embodiment includes a ball screw configured todrive the rotary table 80 so as to reciprocate in the Y direction and aguide mechanism configured to guide reciprocation of the rotary table 80in the Y direction. The ball screw includes a screw shaft 831, a nutmember 832, and a ball (not shown), and the nut member 832 is connectedto the support frame 801 configured to support the rotary table 80through intermediation of the support base 802. The ball screw uses amotor 833 as a drive source and converts forward and backward rotationof the motor 833 into reciprocating linear motion in a screw shaftdirection to cause the rotary table 80 to reciprocate in the Ydirection. The guide mechanism includes a guide rail 834 extending inthe Y direction and a pair of sliders 835 slidably mounted on the guiderail 834. Each of the sliders 835 is arranged on the support base 802,and the guide rail 834 is arranged on a support base 803. In the guidemechanism, each of the sliders 835 slides on the corresponding guiderail 834 to assist the rotary table 80 to reciprocate straight in the Ydirection.

The illumination means 83 is supported by a support plate 804 at a lowerposition of the rotary table 80. The illumination means 83 has an outershape formed to be larger than that of the wafer W and is configured toemit red light in a ring shape. It is preferred that red light to beemitted have a wavelength region of from about 580 nm to about 680 nm,and red light having a peak wavelength of 630 nm be used. Through use ofred light having a wavelength region of from about 580 nm to about 680nm, red light is blocked by the wafer W irrespective of the material forthe wafer W. Therefore, the outer peripheral edge portion of the wafer Wcan be accurately detected by confirming a reception state of red lightby the image pickup means 84. The illumination means 83 includes alight-emitting portion (not shown), for example, a red light-emittingdiode as a light source and has, for example, a plurality oflight-emitting portions arranged in a circumferential shape.

As the image pickup means 84, for example, a CCD camera or a C-MOScamera is used. The image pickup means 84 is arranged on the rotaryshaft 800 of the rotary table 80 in order to image the outer peripheraledge portion of the wafer W as a whole. The image pickup means 84includes an optical filter 840. The optical filter 840 has a feature oftransmitting only red light without transmitting light other than lighthaving a wavelength region of red light with which the illuminationmeans 83 illuminates the wafer W among visible light that enters theimage pickup means 84. As the optical filter 840, a filter that blockslight having a wavelength of 600 nm or less can be preferably used. Theimage pickup means 84 is configured to image the outer peripheral edgeportion of the wafer W and output an image signal thereof to a controldevice (not shown).

In the wafer alignment section D, while the rotary table 80 rotates thewafer W, and the illumination means 83 illuminates the wafer W with redlight, the image pickup means 84 images the outer peripheral edgeportion of the wafer W, and the control device (not shown) processesimage data acquired from the image pickup means 84 to detect the outerperipheral edge portion of the wafer W, to thereby calculate a centerposition of the wafer W. Then, the control device (not shown) comparesthe center position of the wafer W to a predefined reference position ofa center of the wafer W and controls the table moving mechanism 82 basedon a positional displacement amount between the center position and thereference position, to thereby correct the position of the rotary table80 in the X direction and the Y direction and align the center of thewafer W with the reference position. The wafer W subjected topositioning is conveyed to the tape application section F by the firstwafer conveyance mechanism 7.

Next, as illustrated in FIG. 1 and FIG. 2, the frame supply section Eincludes an accommodating cassette 11 capable of accommodating theplurality of dicing frames DF in a stacked state. The accommodatingcassette 11 can raise and lower each of the dicing frames DF through useof a raising and lowering mechanism (not shown), for example, anelevator mechanism. In the frame supply section E, the dicing frame DFis raised and lowered every time the dicing frame DF is taken out to afirst conveyance arm 9A so that the plurality of dicing frames DF aresuccessively supplied to the first conveyance arm 9A. It is preferredthat the dicing frame DF be positioned by appropriate positioning meansin advance.

As illustrated in FIG. 1, the first conveyance arm 9A can reciprocatebetween the frame supply section E and the tape application section Falong a rail 103 extending in the Y direction with a drive source (notshown). The rail 103 is laid on the machine base 100. The firstconveyance arm 9A can hold the dicing frame DF by adsorption andincludes a plurality of adsorption portions 90, for example, adsorptionpads. The first conveyance arm 9A successively takes out the dicingframes DF one by one from the frame supply section E with the adsorptionportions 90 and then conveys and supplies the dicing frames DF to thetape application section F.

Next, as illustrated in FIG. 1, the tape application section F includesa vacuum chamber 6 in order to apply the protective tape PT to the waferW and mount the wafer W on the dicing frame DF through intermediation ofthe protective tape PT under a decompressed state. As illustrated inFIG. 12 to FIG. 17, in the vacuum chamber 6, there are arranged anapplication table 60 configured to support the wafer W, a frame base 61configured to support the dicing frame DF on which the wafer W ismounted, and a pressing member 62 configured to press the protectivetape PT supplied to the wafer W by the tape holding body 30 from above.

The vacuum chamber 6 includes a lower chamber 6B fixed to the machinebase 100 and an upper chamber 6A arranged on the lower chamber 6B so asto move upward and downward, and the upper chamber 6A and the lowerchamber 6B are combined to form the vacuum chamber 6. The applicationtable 60 and the frame base 61 are arranged in the lower chamber 6B, andthe pressing member 62 is arranged in the upper chamber 6A.

As illustrated in FIG. 17, the upper chamber 6A is supported by asupport plate 63 through intermediation of a plurality of guide members64 so as to move upward and downward. Further, a cylinder shaft 650 of araising and lowering cylinder 65 arranged on the support plate 63 isconnected to the upper chamber 6A, and through drive of the raising andlowering cylinder 65, the upper chamber 6A moves in the up-and-downdirection between a coupling position at which the upper chamber 6A iscombined with the lower chamber 6B and a separation position above thelower chamber 6B.

Further, a vacuum adaptor 66 is connected to the upper chamber 6A, andthe vacuum adaptor 66 is connected to a decompression pump (not shown),for example, a vacuum pump. When the upper chamber 6A is combined withthe lower chamber 6B to form the vacuum chamber 6, the vacuum chamber 6can be brought into a decompressed state through exhaust from the vacuumadaptor 66. Further, the decompressed state in the vacuum chamber 6 canbe cancelled by introducing air through the vacuum adaptor 66. Thevacuum chamber 6 can also be brought into an inert gas atmosphere bydecompressing the vacuum chamber 6 and then introducing inert gas suchas argon or nitrogen into the vacuum chamber 6.

As illustrated in FIG. 12 to FIG. 17, the application table 60 has aporous adsorption member 600 formed on an upper surface thereof. Theadsorption member 600 has a decompression pump, for example, a vacuumpump connected thereto and hence can adsorb and hold the wafer W on theupper surface thereof. The wafer W is placed on the application table 60by the first wafer conveyance mechanism 7.

The application table 60 can be raised and lowered in the lower chamber6B by a raising and lowering mechanism 67 while supporting the wafer W.There is no particular limitation on the raising and lowering mechanism67 as long as the raising and lowering mechanism 67 raises and lowersthe application table 60. As illustrated in FIG. 12 to FIG. 17, theraising and lowering mechanism 67 of this embodiment includes a guidemember 670 configured to support the application table 60 so that theapplication table 60 can be raised and lowered with respect to the lowerchamber 6B, a support plate 671 to which the guide member 670 is fixed,a ball screw including a screw shaft 672, a nut member 673, and a ball(not shown), a motor 674 configured to drive the ball screw, a drivepulley 675 connected to the motor 674, a driven pulley 676 mounted onthe screw shaft 672, and a belt 677 stretched between the drive pulley675 and the driven pulley 676. The support plate 671 is connected to thenut member 673, and the raising and lowering mechanism 67 convertsforward and backward rotation of the motor 674 into reciprocating linearmotion in a screw shaft direction with the ball screw to raise and lowerthe application table 60. The application table 60 is usually positionedbelow the frame base 61 at a predetermined interval.

As illustrated in FIG. 12 to FIG. 17, the frame base 61 is positioned soas to surround the application table 60 on an outer side thereof. Theframe base 61 has an annular shape, and the application table 60 canpass through an opening of the frame base 61 at a time of being raisedand lowered. The dicing frame DF is placed on the frame base 61 by thefirst conveyance arm 9A and fixed thereto by appropriate fixing means(not shown). Further, the protective tape PT is placed on the dicingframe DF by the tape holding body 30 to be supplied to the wafer W.

As illustrated in FIG. 12 to FIG. 19, in order to apply the protectivetape PT to the wafer W and mount the wafer W on the dicing frame DFthrough intermediation of the protective tape PT, the pressing member 62includes a protective layer outer periphery retainer 620 configured topress a peripheral portion of the protective layer PL of the protectivetape PT to apply the protective tape PT to the wafer W, a tape outerperiphery retainer 621 configured to press an outer peripheral edgeportion of the protective tape PT to apply the protective tape PT to thedicing frame DF, and elastic members 622 configured to support the tapeouter periphery retainer 621 so that the tape outer periphery retainer621 can be displaced in the up-and-down direction.

The protective layer outer periphery retainer 620 has a ring shape andhas an outer diameter set to be larger than that of the protective layerPL of the protective tape PT. As the protective layer outer peripheryretainer 620, for example, a fluoro-rubber or a rubber material having asurface subjected to fluorine treatment can be used. The protectivelayer outer periphery retainer 620 is held by a first holder 624. Thefirst holder 624 is fixed to a support disc 623, and the protectivelayer outer periphery retainer 620 is fitted in an annular concaveportion formed in a ring-shaped convex portion 625 formed on an outerperipheral edge portion.

The tape outer periphery retainer 621 has a ring shape and has an outerdiameter set to be substantially equal to that of the protective tapePT. The tape outer periphery retainer 621 can be made of, for example, asilicone resin. The tape outer periphery retainer 621 is held by asecond holder 626. The second holder 626 is formed of an annular platematerial, and the tape outer periphery retainer 621 is fixed to anannular groove formed in an outer peripheral edge portion of the secondholder 626.

Further, the second holder 626 is supported by a plurality of mountingmembers 627 fixed to the support disc 623 through use of the elasticmembers 622, for example, springs. With this, when the tape outerperiphery retainer 621 presses the outer peripheral edge portion of theprotective tape PT to apply the protective tape PT to the dicing frameDF, pressing force of the tape outer periphery retainer 621 can be madeconstant.

The pressing member 62 can be moved upward and downward in the upperchamber 6A by a second up-and-down moving mechanism 68. There is noparticular limitation on the second up-and-down moving mechanism 68 aslong as the second up-and-down moving mechanism 68 moves the pressingmember 62 in the up-and-down direction. The second up-and-down movingmechanism 68 of this embodiment includes a guide member 680 configuredto support the pressing member 62 so that the pressing member 62 canmove upward and downward with respect to the upper chamber 6A, a raisingand lowering plate 681 to which the guide member 680 is fixed, raisingand lowering cylinders 682, which are arranged on the upper chamber 6Aand each have a cylinder shaft 683 connected to the raising and loweringplate 681, and a guide mechanism, which is configured to guideup-and-down movement of the pressing member 62 and includes a pluralityof guide rails 684 and a plurality of sliders 685. The guide rails 684are arranged on the upper chamber 6A so as to extend in the up-and-downdirection, and the sliders 685 are arranged on the raising and loweringplate 681 and slidably mounted on the corresponding guide rails 684. Thesecond up-and-down moving mechanism 68 is configured to driveup-and-down movement of the pressing member 62 with the raising andlowering cylinders 682 and guide up-and-down movement of the pressingmember 62 with the guide mechanism.

In the tape application section F, under a decompressed state in thevacuum chamber 6, the irregularities in the circuit forming portion ofthe wafer W are covered with the protective layer PL by applying theperipheral portion of the protective layer PL of the protective tape PTto the outer peripheral edge portion of the wafer W throughintermediation of the pressure-sensitive adhesive layer AL through useof the protective layer outer periphery retainer 620 of the pressingmember 62. Further, the wafer W is mounted on the dicing frame DFthrough intermediation of the protective tape PT by applying the outerperipheral edge portion of the protective tape PT to the dicing frame DFthrough intermediation of the pressure-sensitive adhesive layer ALthrough use of the tape outer periphery retainer 621 of the pressingmember 62 (see FIG. 21(a)). The dicing frame DF having the wafer Wmounted thereon is conveyed to the heating section G by a secondconveyance arm 9B.

As illustrated in FIG. 1, the second conveyance arm 9B can reciprocatebetween the tape application section F and the heating section G alongthe rail 103 extending in the Y direction with a drive source (notshown). The second conveyance arm 9B can hold the dicing frame DF byadsorption and includes a plurality of adsorption portions 90, forexample, adsorption pads in the same manner as in the first conveyancearm 9A. The second conveyance arm 9B takes out the dicing frame DFhaving the wafer W mounted thereon from the tape application section Fwith the adsorption portions 90 and then conveys and supplies the dicingframe DF to the heating section G.

As illustrated in FIG. 1, the heating section G includes a heating table12 configured to heat the dicing frame DF, a reverse arm 13 configuredto hold the dicing frame DF and vertically reverse the held dicing frameDF, and a conveyance table 14 configured to convey the dicing frame DFafter being heated to the frame accommodating section H.

As illustrated in FIG. 20, the heating table 12 enables the dicing frameDF to be placed on an upper surface thereof and fixed thereto withappropriate fixing means (not shown). A circular convex portion 121 isformed on a center region of the upper surface of the heating table 12,and the dicing frame DF is placed on and fixed to the heating table 12so that the wafer W is positioned on the convex portion 121 asillustrated in FIG. 21(a). The heating table 12 contains a heater 120,and the protective tape PT is heated by the heater 120.

The heating table 12 is supported by a table base 122 having a spacetherein. The table base 122 can travel on a pair of rails 104 laid onthe machine base 100 and extending in the X direction throughintermediation of a pair of sliders 123. The heating table 12 canreciprocate in the X direction along the rails 104 through use of, forexample, a motor 124 and a ball screw 125 as a drive source.

As illustrated in FIG. 1, the reverse arm 13 can hold the dicing frameDF by adsorption and includes a plurality of adsorption portions 130,for example, adsorption pads. The reverse arm 13 is supported by asupport frame 131 so as to move in the up-and-down direction through useof a drive source (not shown). The support frame 131 can travel on arail 105 laid on the machine base 100 and extending in the X directionthrough intermediation of a slider (not shown), and the reverse arm 13can reciprocate in the X direction along the rail 105 with a drivesource (for example, a motor and a ball screw) (not shown).

Further, a motor 132 is connected to the reverse arm 13, and the reversearm 13 is rotated by drive of the motor 132. When the reverse arm 13 isturned upside down with the adsorption portions 130 facing upward, thereverse arm 13 can receive the dicing frame DF conveyed by the secondconveyance arm 9B from the second conveyance arm 9B (see FIG. 22). Afterreceiving the dicing frame DF from the second conveyance arm 9B, thereverse arm 13 is rotated in a normal direction with the adsorption portions 130 facing downward. With this, the reverse arm 13 can place thedicing frame DF on the heating table 12 under a state in which theprotective tape PT serves as a lower surface (see FIG. 23).

As illustrated in FIG. 1 and FIG. 20, the conveyance table 14 enablesthe dicing frame DF to be placed on an upper surface thereof and isconfigured to convey the dicing frame DF heated in the heating section Gto the frame accommodating section H. The conveyance table 14 issupported by a plurality of support columns 141 arranged upright on asupport base 140. The conveyance table 14 can travel on a pair of rails106 laid on the machine base 100 and extending in the X directionthrough intermediation of a pair of sliders 142 arranged on the supportbase 140, and can reciprocate in the X direction along the rails 106through use of, for example, a motor 143 and a ball screw 144 as a drivesource. Further, the conveyance table 14 can pass through the innerspace of the table base 122.

In the heating section G, the protective tape PT is heated, for example,at 100° C. for about 1 minute by the heating table 12 to soften theprotective layer PL as illustrated in FIG. 21(b), and the protectivelayer PL is embedded in the irregularities in the circuit formingportion of the wafer W to be brought into close contact therewith. Then,the dicing frame DF is conveyed to the frame accommodating section H bythe conveyance table 14.

Next, as illustrated in FIG. 1, the frame accommodating section Hincludes an accommodating cassette 15 capable of accommodating theplurality of dicing frames DF in a stacked state. The accommodatingcassette 15 can be raised and lowered through use of a raising andlowering mechanism (not shown), for example, an elevator mechanism. Inthe frame accommodating section H, the accommodating cassette 15 israised and lowered every time the dicing frame DF is accommodated sothat the plurality of dicing frames DF are successively accommodated.

Further, as illustrated in FIG. 1, the frame accommodating section Hincludes a pair of conveyance rails 16 connected to the accommodatingcassette 15 and a frame pusher 17 that reciprocates along a rail 107parallel to the conveyance rails 16.

The frame pusher 17 can travel on the rail 107 laid on the machine base100 and extending in the X direction through intermediation of a slider170 and can reciprocate in the X direction along the rail 107 with adrive source (for example, a motor and a ball screw) (not shown).Further, the frame pusher 17 is supported so as to move in theup-and-down direction through use of the drive source (not shown). Whenthe frame pusher 17 pushes the dicing frame DF on the conveyance table14 moved to the vicinity of the conveyance rails 16 toward theaccommodating cassette 15, the dicing frame DF is conveyed from theconveyance rails 16 to the accommodating cassette 15 and accommodated inthe accommodating cassette 15.

Next, an application method of applying the protective tape PT to thewafer W is described.

First, prior to an application operation, the wafer W is taken out fromthe wafer supply section C illustrated in FIG. 1 by the first waferconveyance mechanism 7, and then the wafer W is conveyed to the waferalignment section D to be placed on the rotary table 80.

In the wafer alignment section D, the wafer W is aligned. First, thewafer W is rotated while being supported on the rotary table 80, andunder a state in which the wafer W is illuminated with red light fromone surface side of the wafer W by the illumination means 83, the waferW is imaged from the other surface side of the wafer W by the imagepickup means 84. An outer peripheral edge portion of the wafer W isdetected based on a reception state of red light by the image pickupmeans 84, and a center position of the wafer W is calculated. The waferW is subjected to position adjustment to position the center of thewafer W at a predetermined reference position. Then, the positionedwafer W is conveyed from the rotary table 80 to the tape applicationsection F by the first wafer conveyance mechanism 7, and the wafer W isplaced on and fixed to the application table 60 in the lower chamber 6Bunder a state of being positioned on the application table 60 asillustrated in FIG. 13. In this case, the center position of the wafer Wplaced on the application table 60 is matched with the center positionof the dicing frame DF to be placed on the frame base 61 describedlater.

Further, the dicing frame DF is taken out from the frame supply sectionE illustrated in FIG. 1 by the first conveyance arm 9A and then conveyedto the tape application section F to be placed on and fixed to the framebase 61 in the lower chamber 6B as illustrated in FIG. 13.

Further, in the tape peeling section A illustrated in FIG. 1, theprotective tape PT temporarily applied to the base material BM isconveyed to a peeling position by the tape conveyance mechanism 2, andthe tape holding body 30 is moved onto the protective tape PT conveyedto the peeling position as illustrated in FIG. 5 so that the tapeholding body 30 holds the protective tape PT. Then, as illustrated inFIG. 6 and FIG. 7, the peeling plate 40 is moved to peel the basematerial BM from the protective tape PT held by the tape holding body30. After that, the protective tape PT peeled from the base material BMis conveyed to the tape alignment section B while being held by the tapeholding body 30.

In the tape alignment section B, the protective tape PT is aligned.First, under a state in which the protective tape PT is held by the tapeholding body 30, a plurality of parts (preferably four parts) of anouter peripheral edge portion of the protective layer PL of theprotective tape PT are imaged by the image pickup means 50. Positionalinformation on the plurality of parts of the outer peripheral edgeportion of the protective layer PL is calculated based on image dataobtained by the image pickup means 50, and a center position of theprotective layer PL is calculated. The protective tape PT is subjectedto positional adjustment to position the center of the protective layerPL at a predetermined reference position. Then, the positionedprotective tape PT is conveyed to the tape application section F whilebeing held by the tape holding body 30 as illustrated in FIG. 12, andthe protective tape PT is placed on the dicing frame DF in the lowerchamber 6B as illustrated in FIG. 13. In this case, the center positionof the dicing frame DF placed on the frame base 61 is matched with thecenter position of the protective layer PL of the protective tape PTplaced on the dicing frame DF.

Next, in the tape application section F, the protective tape PT isapplied to the wafer W. First, when the protective tape PT is suppliedabove the wafer W as illustrated in FIG. 13, the upper chamber 6A ismoved downward to be combined with the lower chamber 6B to form thevacuum chamber 6 as illustrated in FIG. 14. Then, the vacuum chamber 6is decompressed through the vacuum adaptor 66 to bring the vacuumchamber 6 into a predetermined decompressed state. At this time, theapplication table 60 is raised to bring the wafer W into contact withthe protective tape PT, and the pressing member 62 is moved downward topress the protective tape PT from above as illustrated in FIG. 15. Inthis case, when the peripheral portion of the protective layer PL of theprotective tape PT is pressed by the protective layer outer peripheryretainer 620 of the pressing member 62, the pressure-sensitive adhesivelayer AL is applied to the outer peripheral edge portion of the wafer W.When the outer peripheral edge portion of the protective tape PT ispressed by the tape outer periphery retainer 621 of the pressing member62, the protective tape PT is applied to the dicing frame DF throughintermediation of the pressure-sensitive adhesive layer AL. With this,the circuit (irregularities) on the front surface of the wafer W iscovered with the protective layer PL, and the wafer W is mounted on thedicing frame DF through intermediation of the protective tape PT. Afterthe vacuum chamber 6 is brought into an atmospheric-pressure state, theupper chamber 6A is moved upward to release the lower chamber 6B asillustrated in FIG. 16, and the dicing frame DF having the wafer Wmounted thereon is conveyed to the heating section G by the secondconveyance arm 9B as illustrated in FIG. 17.

Next, in the heating section G, the dicing frame DF having the wafer Wmounted thereon is heated. First, as illustrated in FIG. 22, the reversearm 13 turned upside down receives the dicing frame DF from the secondconveyance arm 9B. After that, as illustrated in FIG. 23, the dicingframe DF is vertically reversed by rotating the reverse arm 13, and thedicing frame DF is placed on the heating table 12 under a state in whichthe protective tape PT serves as a lower surface. Then, the protectivetape PT is heated by the heater 120 contained in the heating table 12 tosoften the protective layer PL, and the protective layer PL is broughtinto close contact with the irregularities in the circuit formingsection of the wafer W. With this, application of the protective tape PTto the wafer W is completed, and mounting of the wafer W on the dicingframe DF is also completed. Then, as illustrated in FIG. 24 to FIG. 26,the second conveyance arm 9B is moved above the dicing frame DF, and thedicing frame DF is held by the second conveyance arm 9B. After that, thedicing frame DF is lifted up from the heating table 12, and theconveyance table 14 is moved below the second conveyance arm 9B so as toreplace the heating table 12. Then, the dicing frame DF is placed on theconveyance table 14. As illustrated in FIG. 27, the dicing frame DF isconveyed to the frame accommodating section H by the conveyance table14.

Finally, in the frame accommodating section H, as illustrated in FIG.28, the dicing frame DF having the wafer W mounted thereon isaccommodated in the accommodating cassette 15 from the conveyance table14 via the conveyance rails 16 by the frame pusher 17.

As described above, with the application apparatus 1 and the applicationmethod having the above-mentioned configuration, in the tape peelingsection A, the entire surface of the protective tape PT is held by thetape holding body 30, and the base material BM is peeled by the peelingmechanism 4 under a state in which the entire surface of the protectivetape PT is held by the tape holding body 30. With this, the protectivetape PT can be held with low tension so that residual stress does notremain. Further, even when the base material BM is peeled from theprotective tape PT, a load applied to the protective tape PT can beextremely approximated to zero.

As a result, the protective tape PT can be applied to the wafer W undera state in which the residual stress is reduced. Therefore, when thewafer W is reduced in thickness by grinding a back surface of the waferW, the wafer W can be prevented from being warped or broken due to theresidual stress on the protective tape PT.

In addition, with the application apparatus 1 and the application methodhaving the above-mentioned configuration, in the tape applicationsection F, when the wafer W is mounted on the dicing frame DF after theprotective tape PT is applied to the dicing frame DF, the protectivetape PT is applied to the wafer W. With this, the protective tape PT isprevented from being pulled by an application roll at a time ofapplication of the protective tape PT to the wafer W unlike therelated-art method, and hence residual stress can also be prevented frombeing generated on the protective tape PT applied to the wafer W.

Further, with the application apparatus 1 and the application methodhaving the above-mentioned configuration, the protective tape PT is notapplied to the wafer W by being pressed against the wafer W with anapplication roller unlike the related-art method, and hence theirregularities of the wafer W can also be prevented from being broken.This effect is particularly significant with respect to a bump waferhaving irregularities larger than those in the related-art circuitforming section, which have come to be often used for improving thefunction of a wafer in association with the recent increase in densityof a semiconductor.

Thus, according to one embodiment of the present invention, it ispossible to provide an application apparatus and an application methodfor applying a protective tape to a semiconductor wafer, in whichresidual stress generated on a protective tape can be reduced at a timeof application of the protective tape to the wafer W. It is alsopossible to provide an application apparatus and an application methodcapable of satisfactorily applying a protective tape to a bump wafer.

The embodiment of the present invention is described above. However, thepresent invention is not limited thereto, and various modifications canbe made without departing from the spirit of the present invention.

For example, in the above-mentioned embodiment, the dicing frame DFheated in the heating section G is conveyed to the frame accommodatingsection H and accommodated in the accommodating cassette 15. However,the following configuration may be employed. That is, the heated dicingframe DF is conveyed to a tape cutting section I illustrated in FIG. 1by the conveyance table 14, and the protective tape PT applied to thedicing frame DF is cut along the outer shape of the wafer W through useof a cutter unit 18. After that, the wafer W having the protective tapePT separated from the dicing frame DF is conveyed by the second waferconveyance mechanism 19 and accommodated in a wafer accommodatingportion (not shown) or an open portion in the accommodating cassette 10.Now, this configuration is specifically described with reference to FIG.29 to FIG. 35.

First, in FIG. 25, the heated dicing frame DF is taken out from theheating table 12 by the second conveyance arm 9B, and the reverse arm 13turned upside down receives the dicing frame DF from the secondconveyance arm 9B. After that, the dicing frame DF is verticallyreversed by rotating the reverse arm 13, and the dicing frame DF isplaced on the conveyance table 14 under a state in which the wafer Wserves as a lower surface (see FIG. 29). Then, as illustrated in FIG.30, the dicing frame DF is conveyed below the cutter unit 18 of the tapecutting section I by the conveyance table 14. In this embodiment, anupper surface of the conveyance table 14 is appropriately formed into aconvex shape in conformity with the thickness of the wafer W.

The cutter unit 18 is configured to move in the up-and-down directionbetween a cutting position for cutting the protective tape PT and aseparation position above the cutting position through use of a drivesource (not shown). Further, the cutter unit 18 includes a cutter 180, asupport plate 181 configured to support the cutter 180, and a motor 182configured to drive the cutter 180 to rotate.

In the tape cutting section I, as illustrated in FIG. 31, when thedicing frame DF is conveyed, the cutter unit 18 is moved downward, andthe cutter 180 is rotated to cut the protective tape PT along the outershape of the wafer W. Then, as illustrated in FIG. 32, the cutter unit18 is moved upward to be retracted to the separation position, and thesecond wafer conveyance mechanism 19 is moved onto the conveyance table14.

In this embodiment, the second wafer conveyance mechanism 19 isconfigured to reciprocate in the Y direction between the tape cuttingsection I and the wafer alignment section D through use of a drivesource (not shown). Further, the second wafer conveyance mechanism 19includes an adsorption hand 190 capable of holding the wafer W, forexample, by adsorption and a cylinder 191 configured to move theadsorption hand 190 in the up-and-down direction.

When the protective tape PT applied to the dicing frame DF is cut alongthe contour of the wafer W, the adsorption hand 190 is moved downward toadsorb the wafer W having the protective tape PT separated from thedicing frame DF on the conveyance table 14. Then, as illustrated in FIG.33, after the adsorption hand 190 is moved upward, the wafer W havingthe protective tape PT is conveyed to the wafer alignment section D bythe adsorption hand 190 to be placed on the rotary table 80. Then, thewafer W having the protective tape PT placed on the rotary table 80 isconveyed to and accommodated in the wafer accommodating portion (notshown) or the open portion in the accommodating cassette 10 by the firstwafer conveyance mechanism 7.

Meanwhile, the dicing frame DF having the wafer W separated therefrom isconveyed to the frame accommodating section H by the conveyance table 14as illustrated in FIG. 34, and the dicing frame DF is accommodated inthe accommodating cassette 15 from the conveyance table 14 via theconveyance rails 16 by the frame pusher 17 as illustrated in FIG. 35.

The application apparatus 1 having the above-mentioned configuration maybe connected to a back surface grinding device or the like so that thewafer W mounted on the dicing frame DF or the wafer W having theprotective tape PT applied thereto is directly supplied to the backsurface grinding device or the like.

REFERENCE SIGNS LIST

-   1 application apparatus-   2 tape conveyance mechanism-   4 peeling mechanism-   30 tape holding body-   31 holding-body moving mechanism-   40 peeling plate-   41 peeling plate moving mechanism-   61 frame base-   301 adsorption member-   310 first up-and-down moving mechanism-   320 first reciprocation mechanism-   330 second reciprocation mechanism-   W wafer-   BM base material-   PT protective tape-   PL protective layer-   DF dicing frame

The invention claimed is:
 1. An application apparatus for applying aprotective tape to a semiconductor wafer, comprising: a tape conveyancemechanism configured to convey the protective tape temporarily appliedto a base material to a peeling position; a tape holding body that holdsthe protective tape; a holding-body moving mechanism that moves the tapeholding body; a peeling mechanism configured to peel the base materialfrom the protective tape held by the tape holding body at the peelingposition; an application table configured to support the semiconductorwafer; a raising and lowering mechanism configured to raise and lowerthe application table; a frame base arranged in a periphery of and abovethe application table, the frame base being configured to support adicing frame on which the semiconductor wafer is mounted; and a controldevice configured to control operations of the holding-body movingmechanism and the raising and lowering mechanism, wherein the controldevice is configured to control an operation of the holding-body movingmechanism such that the tape holding body moves to the peeling positionand holds the protective tape; wherein the control device is configuredto control operation of the holding-body moving mechanism such that thetape holding body holding the protective tape moves onto the frame baseand applies the protective tape to the dicing frame; and wherein thecontrol device is configured to control an operation of the raising andlowering mechanism such that the application table rises to allow thesemiconductor wafer to be applied to the protective tape applied to thedicing frame.
 2. An application apparatus for applying a protective tapeaccording to claim 1, wherein the base material has a band shape and hasa plurality of protective tapes arranged on the base material atintervals along a conveyance direction of the base material, and whereinthe peeling mechanism includes a peeling plate and a peeling platemoving mechanism configured to cause the peeling plate to reciprocate inthe conveyance direction of the base material, the peeling mechanismbeing configured to peel the base material from the protective tape bymoving the peeling plate in a direction opposite to the conveyancedirection of the base material while folding back the base material witha distal end of the peeling plate.
 3. An application apparatus forapplying a protective tape according to claim 1, wherein the tapeholding body includes an adsorption member that adsorbs an entiresurface of the protective tape.
 4. An application apparatus for applyinga protective tape according to claim 1, wherein the holding-body movingmechanism includes an up-and-down moving mechanism configured to movethe tape holding body in an up-and-down direction and a reciprocationmechanism configured to cause the tape holding body to reciprocate in anX direction along a horizontal surface and in a Y direction orthogonalto the X direction.
 5. An application method of applying a protectivetape to a semiconductor wafer, comprising: a tape conveyance step ofconveying the protective tape temporarily applied to a base material toa peeling position by a tape conveyance mechanism; a holding-body movingstep of moving a tape holding body that holds the protective tape to thepeeling position by a holding-body moving mechanism; a peeling step ofpeeling the base material from the protective tape held by the tapeholding body at the peeling position by a peeling mechanism; a step ofapplying the protective tape to a dicing frame by moving the tapeholding body holding the protective tape onto a frame base supportingthe dicing frame by the holding-body moving mechanism, the frame basebeing arranged in a periphery of and above the application tablesupporting the semiconductor wafer; and a step of mounting thesemiconductor wafer on the dicing frame through the protective tape byapplying the semiconductor wafer to the protective tape applied to thedicing frame by raising the application table by the raising andlowering mechanism.